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Multidisciplinary Engineering Micro-Systems Group Mechanical Engineering: University of Colorado at Boulder |
MEMS and Package for Chip-Scale Integration for Atomic Clocks PIs: Y. C. Lee (PI), Victor M. Bright (Co-PI), Zoya Popovic (Co-PI) Project field/specialty: Project Description: Chip-scale atomic clocks (CSAC) are being developed by the National Institute of Standards and Technology (NIST) at Boulder with an emphasis on the development of ultra-miniaturized cesium cells. The development of CSAC will enable ultra-miniaturized and ultra-low power time and frequency references for high-security ultra-high frequency (UHF) communication and jam-resistant global positioning system (GPS) receivers. The ultra-stable frequency reference from atomic sources will drastically improve channel selectivity and density for all military communications. In surveillance applications, CSAC can be used to improve resolution in Doppler radars and to enhance accuracy of location identification of radio emitters. Other important uses include missile and munitions guidance, robust electronic and information defense networks, and high-confidence identification of friends and foes. This study will focus on MEMS and packaging activities for the atomic clocks. With the Cesium cells integrated with optical and RF units using MEMS and advanced packaging technologies, we will be able to demonstrate an atomic time and frequency reference units with a size of 10mm x 10mm x 2mm (0.2 cm3) and a power dissipation level less than 200 mW while providing frequency accuracy on the order of +/- 1 x 10 -11 (Allen deviation at one-hour integration time). Funding Source: DARPA Publications:
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Last Updated: February 2008 |